Unimicron Technology Corporation Case Study

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Materials Technology Corporation Case Analysis I. Industry Context Industry Overview Industry Summary and Outlook Ceramics Engineering-- the industry that Materials Technology Corporation, or "MTC" is a part of-- is a multi-billion dollar a year industry. Because ceramics can be manufactured to have unique combinations of strength, weight, thermal and magnetic conductivity, and deformability, they have countless uses in industries such as aerospace, biomedical, automotive, and electrical. With an unlimited number of such combinations, it is possible to create a material that exactly suits a given situation. Because of the following combination of factors, there is generally "high demand and low supply" for engineered ceramics: • low cost (once developed) and high quality • An infinite number of potential materials combinations • Applicability of a specific unique ceramic to each use (i.e., increased demand for closely-specified material). Similarly, several factors indicate that the ceramics market is essentially still an emerging market: • the relative newness of the industry; • the need for MTC and other such companies to create the market for their products; and • the unlimited number of potential applications indicate the ceramics industry However, one source1 indicated a few trends that evidence a more mature market: • increased pricing pressures on ceramics manufacturers; • improvements in process engineering; • increasing focus on customers in core businesses; • a number of mergers and acquisitions; • increasing environmental pressures; and

 

 

 

 

 

 

 

- Marketing and Technological Trends in the Global Substrate-Like PCB Industry -

  
DatePublished on January 16, 2018
  
PriceHard Copy & Soft Copy(CD-ROM):520,000JPY
 
SizeA4 x 184 pages
 
  
*To check the detail by PDF file
"Substrate-Like PCB Report 2018"
 
 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 
 
 

Preliminary Chapter the Definition of an SLP & Related Things

0. Remarks   2
1. the Definition of an SLP and Related Things
 1-1. the Definitions of a Motherboard, a Module Board, and a Substrate   5
 1-2. Printed Circuit Boards [PCBs] Occasionally Refer Only to Motherboards   6
 1-3. Modified Semi-Additive Process [MSAP]   7
 1-4. What Does SLP Stand for?   17
2. the Background of the Invention of the SLP and Related Things
 2-1. Dramatic Changes in High-End Smartphones in Recent Years   19
 2-2. the Structure of Each of the SLPs
  2-2-1. As of October 2017 I   23
  2-2-2. As of October 2017 II   25
  2-2-3. As of October 2017 III   26
  2-2-4. the Structure of the 10-Layer SLPs Adopted in iPhone 8's & iPhone 8's Plus   29
  2-2-5. the Structure of the 20-Layer SLPs Adopted in iPhone X's - Provisional Structure A   31
  2-2-6. the Structure of the 20-Layer SLPs Adopted in iPhone X's - Provisional Structure B   33
  2-2-7. Each of the Successive Generations of the iPhones   35


 

Chapter One the Global Market of SLPs & Related Things

1. the Global Market Size and Forecast of SLP-Adopted Products, 2017 - 2026
 1-1. the Global Market Size and Forecast of SLP-Adopted Products in Volume, 2017 - 2026 40
 1-2. the Annual Growth Rates of the Global Market Size of SLP-Adopted Products in Volume, 2017 - 2026  41
2. the Global Market Size and Forecast of SLPs, 2017 - 2026
 2-1. the Global Market Size and Forecast of SLPs in Value, 2017 - 2026 42
 2-2. the Annual Growth Rates of the Global Market Size of SLPs in Value, 2017 - 2026 43
 2-3. the Global Market Size and Forecast of SLPs in SQMs, 2017 - 2026 44
 2-4. the Annual Growth Rates of the Global Market Size of SLPs in SQMs, 2017 - 2026 45
 2-5. the Global Market Size and Forecast of SLPs in Pieces, 2017 - 2026 46
 2-6. the Annual Growth Rates of the Global Market Size of SLPs in Pieces, 2017 - 2026 47
 2-7. the Estimated Average Selling Prices of SLPs in SQMs, 2017 - 2026 48
 2-8. the Estimated Average Selling Prices of SLPs in Pieces, 2017 - 2026 49
3. the Global Market of SLPs in 2017
 3-1. the Entire Global Market of SLPs in USDs & in SQMs in 2017 by Type [X's and 8's & 8's Plus]    55
 3-2. the Entire Global Market of SLPs in USDs & in Pieces in 2017 by Type [X's and 8's & 8's Plus]  56
 3-3. Manufacturers' Share of the Entire Global Market of SLPs in USDs & in SQMs in 2017 by Type [X's and 8's & 8's Plus]  57
 3-4. Manufacturers' Share of the Entire Global Market of SLPs in USDs & in Pieces in 2017 by Type [X's and 8's & 8's Plus]   58
 3-5. Reference Information
  3-5-1. Estimated Average Selling Prices of the SLPs in USD per SQM in 2017  65
  3-5-2. Estimated Average Selling Prices of the SLPs in USD per Piece in 2017   66

 

Chapter Two Materials for SLPs and Related-Things

0. Items Introduced in This Chapter 70
1. Specifications of SLPs and Related Things
 1-1. a Forecast-Like Overview on Future Models of the iPhones with Technological Advancement 71
 1-2. a Forecast-Like Overview on Future Models of the Galaxies with Technological Advancement 73
 1-3. a Forecast-Like Overview on Specifications of SLPs and SiPs Adopted in the iPhones 75
 1-4. a Forecast-Like Overview on Specifications of SLPs and SiPs Adopted in the Galaxies 77
 1-5. a Forecast-Like Overview on Dielectric Characteristics and Others of SLPs and SiPs 79
 1-6. the Global Market Size and Forecast of Materials for SLPs in Value, 2017 - 2026 81
 1-7. the Annual Growth Rates of the Global Market Size of Materials for SLPs in Value, 2017 - 2026 82
 1-8. the Global Market Size and Forecast of Materials for SLPs in Volume, 2017 - 2026 83
 1-9. the Annual Growth Rates of the Global Market Size of Materials for SLPs in Volume, 2017 - 2026 84
 1-10. the Estimated Average Selling Prices of Materials for SLPs in SQMs, 2017 - 2026 87
2. Materials for SLPs and Their Specifications
 2-1. Prepregs for the 8-layer SLPs and the 10-layer SLPs 89
 2-2. a Copper-Clad Laminate for the Double-Sided Interposers Which are Hollow Inside 97
 2-3. a Copper Foil for the MSAP Layers 101
 2-4. Electrodeposited Copper Platings for Use in Via Filling of the MSAP Layers of SLPs 107
 2-5. a Solder Resist for the 8-layer SLPs and the 10-layer SLPs 115
3. Manufacturing Systems for SLPs
 3-1. Orbotech's LDI Systems for Use in SLP Manufacturing 119
 3-2. Orc's LDI Systems for Use in SLP Manufacturing 121
 3-3. Installation Status of Laser Direct Imaging Systems for Use in the MSAP Layers of SLPs 123

 

Chapter Three Case Studies

Austria Technologie & Systemtechnik AG 125
Compeq Manufacturing Co., Ltd. 140
Kinsus Interconnect Technology Corporation 155
Unimicron Technology Corporation 170

 


 

 

 

 

 

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